Ralink Technology --雷凌科技

公司简介: 

雷凌科技股份有限公司(Ralink Technology Corporation)是无线局域网络芯片组解决方案的领先创新者和开发商。Ralink 802.11x 芯片因 Wi-Fi、移动和嵌入式应用所需的卓越吞吐量、扩展范围、低功耗及一致的可靠性而获得认可。这些功能丰富的芯片组拥有用于客户端的高档芯片集成,以及用于 CB、MiniPCI、PCI、PCIe 和 USB 接口的 AP 解决方案,有助于客户经济有效地制造更小、更复杂的移动无线产品。雷凌科技的 MIMObility™专利技术将 Wi-Fi 应用从传统的 PC 网络扩展到各种数字多媒体和手持式设备。如手机、PDA、相机、打印服务器、HDTV 及视频游戏播放器等。通过 802.11n 解决方案,雷凌科技的客户将能够持续提升新一代高性能 Wi-Fi 的速度、带宽及可靠性。雷凌科技成立于2001 年,总部位于台湾新竹,并在加州库珀蒂诺设有研发中心。有关更多信息,请访问雷凌科技网站 www.ralinktech.com 或发送电子邮件至 info@ralinktech.com。

公司关联信息: 
公司销售联系信息: 

雷凌科技股份有限公司 (台湾)
新竹县竹北市台元街36号5楼(台元科技园区)
电话 (03) 5600868
传真 (03) 5600818
Sales Taiwan:Sales@ralinktech.com.tw
Technical Support Taiwan:FAE@ralinktech.com.tw
Taiwan Resumes:jobs@ralinktech.com.tw

Ralink Technology Corporation (U.S. Offices)
20833 Stevens Creek Blvd, Suite 200
Cupertino CA 95014
Telephone (408) 725-8070
Fax (408) 725-8069
marketing@ralinktech.com, jobs@ralinktech.com

雷凌科技股份有限公司(Ralink Technology Corporation)是无线局域网络芯片组解决方案的领先创新者和开发商。Ralink 802.11x 芯片因 Wi-Fi、移动和嵌入式应用所需的卓越吞吐量、扩展范围、低功耗及一致的可靠性而获得认可。这些功能丰富的芯片组拥有用于客户端的高档芯片集成,以及用于 CB、MiniPCI、PCI、PCIe 和 USB 接口的 AP 解决方案,有助于客户经济有效地制造更小、更复杂的移动无线产品。雷凌科技的 MIMObility™专利技术将 Wi-Fi 应用从传统的 PC 网络扩展到各种数字多媒体和手持式设备。如手机、PDA、相机、打印服务器、HDTV 及视频游戏播放器等。通过 802.11n 解决方案,雷凌科技的客户将能够持续提升新一代高性能 Wi-Fi 的速度、带宽及可靠性。雷凌科技成立于2001 年,总部位于台湾新竹,并在加州库珀蒂诺设有研发中心。有关更多信息,请访问雷凌科技网站 www.ralinktech.com 或发送电子邮件至 info@ralinktech.com。

The Ralink Difference
Ralink patented MIMO technologies provide a flexible path for continuous innovation across draft IEEE 802.11n, 802.11 a/b/g and b/g standards.

Extend traditional PC networking to digital multimedia and handheld devices and ensure dependable, cost-effective wireless connectivity at higher throughput over an extended range.

Technology
Ralink technology is field-proven with more than 45 million chipsets delivered to manufacturers of PC networking, mobile/handheld and digital multimedia applications worldwide. Ralink is recognized for superior performance and a comprehensive feature set that meets current and emerging Wi-Fi standards. We provide solutions for miniPCI, PCI, CB, USB and PCIe interfaces with 2.4 and 2.4/5 GHz support. Each Ralink chipset features two highly integrated IC’s – RFIC and BB/MAC IC – which are fully compliant with draft IEEE 802.11n and 802.11a/b/g/ and b/g standards.

Architecture
Ralink’s Optimized RF Architecture and baseband algorithms provide superior performance with low-power consumption and consistent reliability.

Patented MIMO technologies
Ralink 802.11n chipsets deliver patented MIMObility™ technology with support for up to 300Mbps PHY and robust connections at extended range while mitigating dead spots. With MIMObility™, Wi-Fi applications can be extended from traditional PC networking to a wide range of digital multimedia and handheld devices.

Greater interference resistance helps customers tailor wireless networking solutions for high-throughput and latency-sensitive applications such as IPTV, Video on Demand, Internet radio, Voice over IP, onling gaming and more.

In current Ralink chipsets, MIMO XR™ (eXtended Range) employs multiple techniques – including frame aggregation, packet bursting and maximum ratio combining (MIMO-MRC) – to dramatically increase the throughput and range of wireless networking products.